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Electro Ceramic & Device Group
Found year:1999
Technology Licensed from Panasonic
Taiwan Headquarter (since 1968), Shanghai Factory (Since 2004)
Capability Highlights
- High Accuracy Multi-layer LTCC Substrate (X,Y tolerance +/- 0.05%; 10 times better than conventional shrinkage process +/-0.5%)
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Cu Slug Ceramic Substrate (> 300W/m'k Thermal Conductivity)
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Hermetic Ceramic Package (10^-8)
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Custom Thin/Thick Film Service
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Turnkey Assembling Packaging Service (GGI, C4, ACF, COB, SMT, Encapsulation & Dicing)

Substrate/Material Option
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Low Temp. Co-fired Ceramic
(Glass Ceramic) |
Shrinkage Process
(X,Y tolerance +/-0.5%) |
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Non-Shrinkage Process
Technology transferred from
since 1999 |
|
High Temp. Ceramic |
Al2O3 |
|
AlN |
Metallization
Metal Roughness: 0.05um by Polishing or 0.3um by Lapping
Electrolytic & Electro-less Plating
Hot Item!
The Best Annual LED Thermal Dissipation Technology Award
¨Low Cost Cu Slug Ceramic Substrateกจ
File Access:
Contact Infomation:
Jason Huang
Tel: +886-3-489-2377 ext 372
Fax: +886-3-470-7594
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