Products
Automotive
Electro Ceramic & Device
High Accuracy LTCC
Metalized Al2O3 & AlN
IC Packaging Service
 
 

Electro Ceramic & Device Group

Found year:1999
Technology Licensed from Panasonic
 
 
          
Taiwan Headquarter (since 1968), Shanghai Factory (Since 2004)
 
Capability Highlights
  • High Accuracy Multi-layer LTCC Substrate (X,Y tolerance +/- 0.05%; 10 times better than conventional shrinkage process +/-0.5%)
  • Cu Slug Ceramic Substrate (> 300W/m'k Thermal Conductivity)
  • Hermetic Ceramic Package (10^-8)
  • Custom Thin/Thick Film Service
  • Turnkey Assembling Packaging Service (GGI, C4, ACF, COB, SMT, Encapsulation & Dicing)

Substrate/Material Option
 
Low Temp. Co-fired Ceramic
(Glass Ceramic)
Shrinkage Process
(X,Y tolerance +/-0.5%)
Non-Shrinkage Process
Technology transferred from
since 1999
High Temp. Ceramic
Al2O3
AlN
 
Metallization
  • Thick Film Process with Various Metal Options (example: Ag, Cu, Al or Au)
  • Thin Film Process with Various Metal Option(example: Ti/Cu, Cu or Al)
Metal Roughness: 0.05um by Polishing or 0.3um by Lapping
 
 
Electrolytic & Electro-less Plating
  • Electrolytic: Cu, Ni/Au
  • Electroless: Ni/Pd/Au, Ni/Au
 
Hot Item!
The Best Annual LED Thermal Dissipation Technology Award
¨Low Cost Cu Slug Ceramic Substrateกจ
 
 
File Access:
 
Contact Infomation:
Jason Huang
Tel:  +886-3-489-2377 ext 372
Fax: +886-3-470-7594
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